Job Details

OverviewKeysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our 15,000 employees create world‑class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.Our award‑winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry‑first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.ResponsibilitiesWe focus on process development, process integration, and New Product Introduction. You will lead the development of next‑generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.Responsibilities may include:Develop and maintain wafer fabrication processesDevelop and maintain package assembly processesSpecify, select and qualify new equipmentContribute to process automationReview new designs for manufacturability and provide feedback to module designersUnderstand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targetsLead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teamsMeet accelerated project schedules; communicate and manage risksDevelop and maintain high yields while adhering to project schedulesWe are seeking an industry professional with proven expertise in one or more of the following areas:Design for manufacturing of electromechanical assembliesStatistical process control (SPC), design of experiments (DOE)Thermocompression / flip chip bondingSurface Mount Technology (SMT) processesDie singulationSemiconductor fabrication processesHeterogeneous integration, advanced packaging techniquesNew technology introductionNew product introductionThis role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross‑functional interactions.QualificationsBS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.Professional experience in the following areas is desired:III‑V compound semiconductors and/or silicon technologiesThermal, mechanical and electrical reliabilityTechnical project management, project lifecycleCareers Privacy Statement Keysight is an Equal Opportunity Employer.The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.California Pay range: $128,670.00 - $214,440.00US Employees may be eligible for the following benefits:Medical, dental and visionHealth Savings AccountHealth Care and Dependent Care Flexible Spending AccountsLife, Accident, Disability insuranceBusiness Travel Accident and Business Travel Health401(k) PlanFlexible Time Off, Paid HolidaysPaid Family LeaveDiscounts, PerksTuition ReimbursementAdoption AssistanceESPP (Employee Stock Purchase Plan)Restricted Stock Units#J-18808-Ljbffr