Job Details

A leading technology company in Santa Rosa, CA seeks an experienced professional to lead the development of next-generation System in Package (SiP) modules. The role involves process development, integration, and new product introduction, requiring strong leadership and expertise in various manufacturing techniques. Ideal candidates will have a BS or MS in relevant fields and a background in semiconductor technologies. Competitive salary range is $128,670 - $214,440.#J-18808-Ljbffr