Job Details

Job Description

We are seeking expert Physical Design Engineers to lead top-level signoff activities for complex SoCs on advanced nodes (5nm / 3nm / 2nm). The ideal candidate will have multiple full-cycle tapeouts and the technical depth to independently drive signoff-to-tapeout closure. This role requires close collaboration with RTL, Timing, Power Integrity, and Foundry teams to ensure structural integrity, timing convergence, and power reliability for high-performance silicon.

Core Responsibilities

• Drive top-level signoff for high-performance SoC designs.
• Collaborate with RTL, Physical Design, STA, and cross-functional teams.
• Execute, analyze, and debug complex full-chip design challenges.
• Develop and optimize signoff methodologies to improve TAT (Turn-Around Time) and PPA (Power, Performance, Area).
• Identify and mitigate timing, power, reliability, and clocking risks at full-chip level.
• Deliver signoff closure and tapeout readiness independently.

Specialized Tracks (Expertise in at least one area)

Track 1: Top-Level EMIR (Power Integrity)

• Perform Static & Dynamic IR Drop analysis.
• Execute Electromigration (EM) verification.
• Optimize PDN for reliability and noise margins.
• Tools: Ansys RedHawk-SC, Cadence Voltus.

Track 2: Top-Level Timing & STA

• Own full-chip STA across all PVT corners and modes.
• Manage MMMC timing closure and ECOs.
• Tools: Synopsys PrimeTime, Cadence Tempus.

Track 3: Top-Level Clock Distribution

• Design and analyze clock architectures (H-Tree, Mesh, Hybrid).
• Drive CTS for ultra-low skew and balanced latency.
• Tools: Cadence Innovus, Synopsys Fusion, SPICE simulation.

Required Qualifications

• BS/MS in Electrical/Computer Engineering or related field.
• 8+ years of experience in Physical Design/Signoff.
• Proven track record with 2–3 successful tapeouts on advanced nodes (5nm, 3nm, 2nm).
• Deep knowledge of OCV, AOCV/POCV, statistical timing methodologies.
• Strong scripting skills (Tcl, Python, Perl).
• Excellent debugging, analytical, and communication skills.

Preferred Skills

• Experience with 2.5D/3D IC packaging signoff.
• Familiarity with foundry signoff methodologies (TSMC, Samsung, Intel).
• Background in HPC, AI accelerators, or large-scale SoC designs.