Job Details

Principal R&D Engineer – IC Design (Bay Area, CA)

Are you passionate about pushing the boundaries of chip and package design? A top-tier team developing next-gen network switches for enterprise and mega-scale data centers is seeking an experienced R&D Engineer with a focus on advanced interposer technologies.

In this role, you will:

• Design/layout cutting edge CoWos 2.5D, 3D interposer, starting with custom routing for high-speed interfaces, bump map design, routing and physical verification and tapeout to foundries
• Collaborate with packaging, signal integrity, and foundry teams to meet design and physical requirements

We're looking for someone with:

• 10+ years of experience in interposer and advanced packaging design
• Deep knowledge of tools like Cadence (Innovus & Integrity), Synopsys 3DIC Compiler, and Mentor Graphics Calibre
• Strong understanding of TSVs, micro-bumps, solder bumps, and interconnect technologies
• Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization
• Familiarity with semiconductor fabrication processes and 3DBlox is a plus

Compensation:

• Total package ranges from $400K to $500K, depending on experience and fit

Location:

• Onsite in the Bay Area

This is a great opportunity for someone who thrives in a cross-functional, high-performance environment and enjoys taking designs from concept through to tapeout.

If this sounds like a fit—or you know someone who might be—let's connect. Feel free to message me or drop a comment below.