Job Details

Overview

Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our approximately 15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our powerful, award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. Diversity, equity & inclusion are integral parts of our culture and drivers of innovation at Keysight. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Responsibilities

Semiconductor Process Development Engineers at HFTC are responsible for advanced process development and sustaining of custom, cutting-edge micro and nano-fabrication technologies for high-performance microwave and millimeter-wave applications. These technologies include InP and GaAs-based HBTs, HEMTs, diodes, and other electronic components that enable Keysight's industry-leading RF, microwave, and high bit rate instruments.

The focus of this position is on advanced high-frequency packaging development, as well as Die Fab & Backside processes for current and future MMIC products. These processes include heterogeneous integration of high-frequency components, MMIC wafer thinning, wafer separation, dicing, chip sorting, visual inspection, and outgoing quality. Responsibilities include, but are not limited to:

• Driving heterogeneous integration development projects critical to Keysight's high-frequency packaging roadmap
• Owning Die Fab processes and equipment to drive production sustaining and R&D activities
• Collaborating with process, integration, product, and circuit design engineers to define process and device performance targets
• Defining process flows, developing new fabrication processes, and driving continuous process improvement (CPI) efforts to maximize product yield
• Ensuring successful transfer and maintenance of new technologies in manufacturing, encompassing performance, reliability, and manufacturing goals
• Working with Operations to implement robust process control, diagnose, and resolve process problems
• Leading capital equipment acquisition projects, including tool evaluation, characterization, process development, and qualification

Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience
• Previous experience in heterogeneous integration, advanced packaging & assembly techniques, MMIC wafer thinning, and Die Fab operations such as laser separation, saw separation, chip sort, auto-visual, and other backend processes is highly desired
• At least 3 years of experience in advanced semiconductor processes and devices; specific skills in III-V semiconductor processing are highly preferred
• Experience with statistical process control and design of experiments
• Strong problem-solving, analytical, interpersonal, and communication skills for effective collaboration
• Self-initiative and proactive attitude

Careers Privacy Statement

***Keysight is an Equal Opportunity Employer.***

Keysight Technologies Inc. is committed to equal opportunity employment. Qualified applicants will be considered without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability, or any other protected categories under applicable laws.

The role level will be based on experience, education, and skills; most offers will be within the salary range specified below.

California Pay range: $119,610.00 - $199,340.00

Note: Pay ranges for other locations will vary by region.

This role is eligible for the Keysight Results Bonus Program.

US employees may be eligible for benefits including medical, dental, vision, HSA, FSA, insurance, 401(k), flexible time off, paid holidays, paid family leave, discounts, tuition reimbursement, adoption assistance, and ESPP.